Cooler Q1 Intel 1700 - 1U Passive RoHS

item no.: A 2727

Product in stock

-- €

LGA 1851/1700

Recommend for Intel® Alder Lake S Processor

Copper Heatsink with skiving fins for 1U Server

Up to TDP 130W

Shin-Etsu 7762 Pre-printed

Disclaimer: All product specifications and product images are subject to change without notice

SPECIFICATIONS:

Application
CPU Socket	LGA 1851/1700
CPU	Recommend for Intel® Alder Lake S Processor
Solution	Passive Copper Heatsink for 1U Server
Technical Data
Overall dimension	90 x 90 x 27 mm
Weight	533.7g
Heat Sink
Material	Copper Heat Sink with Skiving Fins
Fan
Thermal grease	Pre-Printed with SHIN-ETSU 7762